SN74LVC1G98-Q1 Datasheet, PDF (1/13 Pages) Texas Instruments – CONFIGURABLE MULTIPLE-FUNCTION GATE

SN74LVC1G98-Q1
www.ti.com ........................................................................................................................................................ SCES562C – MARCH 2004 – REVISED APRIL 2008
CONFIGURABLE MULTIPLE-FUNCTION GATE
FEATURES
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• Qualified for Automotive Applications
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 7.3 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV OR DCK PACKAGE
(TOP VIEW)
In1 ¹
GND 2
In0 ³
6 _In2
5 V_CC
4_Y
DESCRIPTION/ORDERING INFORMATION
This configurable multiple-function gate is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G98-Q1 features configurable multiple functions. The output state is determined by eight patterns
of 3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter.
All inputs can be connected to V_CC or GND.
This device functions as an independent gate, but because of Schmitt action, it may have different input
threshold levels for positive-going (V_T+) and negative-going (V_T–) signals.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–40°C to 125°C
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
SOT (SOT-23) – DBV
Tape and reel
SN74LVC1G98QDBVRQ1
SOT (SC-70) – DCK
Tape and reel
SN74LVC1G98QDCKRQ1
TOP-SIDE MARKING⁽³⁾
C98_
CW_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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