SN74LVC1G175-EP Datasheet, PDF (1/14 Pages) Texas Instruments – SINGLE D-TYPE FLIP-FLOP WITH ASYNCHRONOUS CLEAR

SN74LVC1G175-EP
www.ti.com
SGLS366A – AUGUST 2006 – REVISED DECEMBER 2010
SINGLE D-TYPE FLIP-FLOP
WITH ASYNCHRONOUS CLEAR
Check for Samples: SN74LVC1G175-EP
FEATURES
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• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 4.3 ns at 3.3 V
• Low Power Consumption, 10-mA Max I_CC
• ±24-mA Output Drive at 3.3 V
• I_off Supports Partial Power-Down-Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
• Controlled Baseline
• One Assembly/Test Site
• One Fabrication Site
• Available in Military (–55°C/125°C)
Temperature Range⁽¹⁾
• Extended Product Life Cycle
• Extended Product-Change Notification
• Product Traceability
DCK PACKAGE
(TOP VIEW)
CLK
1
6 CLR
GND
2
5
V_CC
D
3
4Q
(1) Additional temperature ranges available - contact factory
DESCRIPTION/ORDERING INFORMATION
This single D-type flip-flop is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G175 has an asynchronous clear (CLR) input. When CLR is high, data from the input pin (D) is
transferred to the output pin (Q) on the clock's (CLK) rising edge. When CLR is low, Q is forced into the low
state, regardless of the clock edge or data on D.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–55°C to 125°C
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
SOT (SC-70) – DCK
Reel of 3000
CLVC1G175MDCKREP
TOP-SIDE MARKING⁽³⁾
BUD
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(3) The actual top-side marking has one additional character that designates the assembly/test site.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2010, Texas Instruments Incorporated