English
Language : 

SN74LVC1G17-EP Datasheet, PDF (1/15 Pages) Texas Instruments – SINGLE SCHMITT-TRIGGER BUFFER
SN74LVC1G17-EP
www.ti.com
SGLS336A – APRIL 2006 – REVISED JUNE 2007
SINGLE SCHMITT-TRIGGER BUFFER
FEATURES
• Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
• Extended Temperature Performance of –55°C
to 125°C
• Enhanced Diminishing Manufacturing Sources
(DMS) Support
• Qualification Pedigree(1)
• Supports 5-V VCC Operation
• Max tpd of 4.6 ns at 3.3 V
• Low Power Consumption, 10 μA Max ICC
• ±24 mA Output Drive at 3.3 V
• Ioff Supports Partial Power Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DCK PACKAGE
(TOP VIEW)
NC
1
5
VCC
A
2
GND
3
4Y
DBV PACKAGE
(TOP VIEW)
NC 1
5
VCC
A
2
GND
3
4
Y
DESCRIPTION/ORDERING INFORMATION
This single Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as an
independent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going
(VT+) and negative-going (VT–) signals.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
TA
–55°C to 125°C
ORDERING INFORMATION(1)
PACKAGE (2)
ORDERABLE PART NUMBER
SOT (SC-70) - DCK
Reel of 3000
SN74LVC1G17MDCKREP
SOP (SOT-23) - DBV
Reel of 3000
SN74LVC1G17MDBVREP
TOP-SIDE MARKING
C70
C170
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
INPUT A
H
L
OUTPUT Y
H
L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2007, Texas Instruments Incorporated