SN74LVC1G125-Q1_15 Datasheet, PDF (1/14 Pages) Texas Instruments – SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT

SN74LVC1G125-Q1
www.ti.com........................................................................................................................................................... SGES002C – APRIL 2003 – REVISED APRIL 2008
SINGLE BUS BUFFER GATE
WITH 3-STATE OUTPUT
FEATURES
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• Qualified for Automotive Applications
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• I_off Supports Partial-Power-Down Mode
Operation
DBV PACKAGE
(TOP VIEW)
OE
1
5
A
2
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
V_CC
OE
1
5
V_CC
A
2
GND
3
4Y
GND
3
4
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This bus buffer gate is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G125 is a single line driver with a 3-state output. The output is disabled when the output-enable
(OE) input is high.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to V_CC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
T_A
–40°C to 125°C
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
SOT (SC-70) – DCK
Reel of 3000
1P1G125QDCKRQ1
SOT (SOT-23) – DBV
Reel of 3000
CLVC1G125QDBVRQ1
TOP-SIDE MARKING⁽³⁾
CM_
C25_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
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PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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