SN74LVC1G08-Q1 Datasheet, PDF (1/11 Pages) Texas Instruments – SINGLE 2-INPUT POSITIVE-AND GATE

SN74LVC1G08-Q1
www.ti.com......................................................................................................................................................... SCES556F – MARCH 2004 – REVISED APRIL 2008
SINGLE 2-INPUT POSITIVE-AND GATE
FEATURES
1
• Qualified for Automotive Applications
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 3.6 ns at 3.3 V
• Low Power Consumption, 10-µA Max I_CC
• ±24-mA Output Drive at 3.3 V
• I_off Supports Partial-Power-Down Mode
Operation
DBV PACKAGE
(TOP VIEW)
A
1
5
B
2
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
V_CC
A1
5
V_CC
B2
GND 3
4Y
GND
3
4
Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
The SN74LVC1G08 performs the Boolean function A • B or Y = A + B in positive logic.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–40°C to 125°C
–40°C to 85°C
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
SOT (SOT-23) – DBV Reel of 3000
SN74LVC1G08QDBVRQ1
SOT (SC-70) – DCK Reel of 3000
SN74LVC1G08QDCKRQ1
SOT (SOT-23) – DBV Reel of 3000
SN74LVC1G08IDBVRQ1
SOT (SC-70) – DCK Reel of 3000
SN74LVC1G08IDCKRQ1
TOP-SIDE MARKING⁽³⁾
C08_
CE_
C08_
CE_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
FUNCTION TABLE
INPUTS
A
B
H
H
L
X
X
L
OUTPUT
Y
H
L
L
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2008, Texas Instruments Incorporated