SN74LVC1G02DSFR Datasheet, PDF (1/22 Pages) Texas Instruments – SINGLE 2-INPUT POSITIVE NOR-GATE

SN74LVC1G02
www.ti.com
SCES213S – APRIL 1999 – REVISED MARCH 2011
SINGLE 2-INPUT POSITIVE NOR-GATE
Check for Samples: SN74LVC1G02
FEATURES
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• Available in the Texas Instruments NanoFree™
Package
• Supports 5-V V_CC Operation
• Inputs Accept Voltages to 5.5 V
• Max t_pd of 3.6 ns at 3.3 V
• Low Power Consumption, 10-μA Max I_CC
• ±24-mA Output Drive at 3.3 V
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
A
1
5
V_CC
A
1
5
V_CC
A1
5 V_CC
B
2
B2
B
2
GND 3 4 Y
GND
3
4Y
GND
3
4
Y
DRY PACKAGE
(TOP VIEW)
A¹
B²
GND ³
6 V_CC
5 _NC
4Y
YZP PACKAGE
(BOTTOM VIEW)
GND ^{3 4} Y
B²
A ^{1 5} V_CC
NC – No internal connection
See mechanical drawings for dimensions.
DSF PACKAGE
(TOP VIEW)
A¹
B²
GND ³
6 V_CC
5 _NC
4_Y
DESCRIPTION/ORDERING INFORMATION
This single 2-input positive-NOR gate is designed for 1.65-V to 5.5-V V_CC operation.
The SN74LVC1G02 performs the Boolean function Y = A + B or Y = A • B in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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