SN74LV244A-EP Datasheet, PDF (1/12 Pages) Texas Instruments – OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS

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FEATURES
• Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
• Extended Temperature Performance of –55°C
to 125°C
• Enhanced Diminishing Manufacturing
Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree ⁽¹⁾
• 2-V to 5.5-V V_CC Operation
• Max t_pd of 6.5 ns at 5 V
• Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 3.3 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot)
>2.3 V at V_CC = 3.3 V, T_A = 25°C
• Supports Mixed-Mode Voltage Operation on
All Ports
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 250 mA Per
JESD 17
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
SN74LV244A-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCLS695 – JANUARY 2006
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DW PACKAGE
(TOP VIEW)
1OE 1
1A1 2
2Y4 3
1A2 4
2Y3 5
1A3 6
2Y2 7
1A4 8
2Y1 9
GND 10
20 ^VCC
19 ^2OE
18 1Y1
17 2A4
16 1Y2
15 2A3
14 1Y3
13 2A2
12 1Y4
11 2A1
DESCRIPTION/ORDERING INFORMATION
This octal buffer/line driver is designed for 2-V to 5.5-V V_CC operation.
The SN74LV244A-EP is designed specifically to improve both the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
The device is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low, the
device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance
state.
To ensure the high-impedance state during power up or power down, OE should be tied to V_CC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the devices when they are powered down.
T_A
–55°C to 125°C
SOIC – DW
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER
Reel of 2000
SN74LV244AMDWREP
TOP-SIDE MARKING
LV244AMEP
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated