SN74LV125AT Datasheet, PDF (1/19 Pages) Texas Instruments – QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS

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FEATURES
• Inputs Are TTL-Voltage Compatible
• 4.5-V to 5.5-V V_CC Operation
• Typical t_pd of 3.8 ns at 5 V
• Typical V_OLP (Output Ground Bounce)
<0.8 V at V_CC = 5 V, T_A = 25°C
• Typical V_OHV (Output V_OH Undershoot)
>2.3 V at V_CC = 5 V, T_A = 25°C
• Support Mixed-Mode Voltage Operation on All
Ports
D, DB, NS, OR PW PACKAGE
(TOP VIEW)
1OE 1
1A 2
1Y 3
2OE 4
2A 5
2Y 6
GND 7
14 VCC
13 4OE
12 4A
11 4Y
10 3OE
9 3A
8 3Y
SN74LV125AT
QUADRUPLE BUS BUFFER GATE
WITH 3-STATE OUTPUTS
SCES629A – MAY 2005 – REVISED AUGUST 2005
• I_off Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 250 mA Per
JESD 17
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
XXXX
XXXX
RGY PACKAGE
(TOP VIEW)
1
1A 2
1Y 3
2OE 4
2A 5
2Y 6
7
14
13 4OE
12 4A
11 4Y
10 3OE
9 3A
8
DESCRIPTION/ORDERING INFORMATION
The SN74LV125AT is a quadruple bus buffer gate. This device features independent line drivers with 3-state
outputs. Each output is disabled when the associated output-enable (OE) input is high.
To ensure the high-impedance state during power up or power down, OE should be tied to V_CC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
T_A
–40°C to 85°C
QFN – RGY
SOIC – D
SOP – NS
SSOP – DB
TSSOP – PW
ORDERING INFORMATION
PACKAGE ⁽¹⁾
ORDERABLE PART NUMBER
Reel of 1000
SN74LV125ATRGYR
Tube of 50
SN74LV125ATD
Reel of 2500
SN74LV125ATDR
Tube of 50
SN74LV125ATNS
Reel of 2000
SN74LV125ATNSR
Tube of 80
SN74LV125ATDB
Reel of 2000
SN74LV125ATDBR
Tube of 90
SN74LV125ATPW
Reel of 2000
SN74LV125ATPWR
Reel of 250
SN74LV125ATPWT
TOP-SIDE MARKING
VV125
LV125AT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated