SN74BCT760-EP Datasheet, PDF (1/11 Pages) Texas Instruments – OCTAL BUFFER/DRIVER WITH OPEN-COLLECTOR OUTPUTS

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FEATURES
• Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
• Extended Temperature Performance of –55°C
to 125°C
• Enhanced Diminishing Manufacturing
Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree ⁽¹⁾
• Open-Collector Version of 'BCT244
• Open-Collector Outputs Drive Bus Lines or
Buffer Memory Address Registers
• ESD Protection Exceeds 2000 V Per
MIL-STD-883C Method 3015
• Available In Plastic Small-Outline (DW)
Package
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
SN74BCT760-EP
OCTAL BUFFER/DRIVER
WITH OPEN-COLLECTOR OUTPUTS
SCBS817B – JULY 2006 – REVISED SEPTEMBER 2006
DW PACKAGE
(TOP VIEW)
1OE 1
1A1 2
2Y4 3
1A2 4
2Y3 5
1A3 ⁶
2Y2 ⁷
1A4 ⁸
2Y1 ⁹
GND ¹⁰
20 V_CC
19 2OE
18 1Y1
17 2A4
16 1Y2
15 2A3
14 1Y3
13 _2A2
12 _1Y4
11 _2A1
DESCRIPTION/ORDERING INFORMATION
The SN74BCT760 octal buffer and line driver is designed specifically to improve both the performance and
density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The SN74BCT760 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When
OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
The device is characterized for operation over the full military temperature range of –55°C to 125°C.
ORDERING INFORMATION
T_A
–55°C to 125°C
PACKAGE ⁽¹⁾
SOIC – DW
Tape and reel
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SN74BCT760MDWREP
BCT760MEP
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(each buffer)
INPUTS
OE
A
L
H
L
L
H
X
OUTPUT
Y
H
L
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated