SN74ALVC244-EP Datasheet, PDF (1/11 Pages) Texas Instruments – OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS

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FEATURES
• Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
• Enhanced Diminishing Manufacturing
Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree⁽¹⁾
• Operates From 1.65-V to 3.6-V V_CC
• Max t_pd of 2.8 ns at 3.3-V V_CC
• ±24-mA Output Drive at 3.3-V V_CC
• Latch-Up Performance Exceeds 250 mA Per
JESD 17
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
(1) _{Component qualification in accordance with JEDEC and}
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
SN74ALVC244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCES600A – AUGUST 2004 – REVISED OCTOBER 2004
PW PACKAGE
(TOP VIEW)
1OE 1
1A1 2
2Y4 3
1A2 4
2Y3 5
1A3 6
2Y2 7
1A4 8
2Y1 9
GND 10
20 V_CC
19 2OE
18 1Y1
17 2A4
16 1Y2
15 2A3
14 1Y3
13 2A2
12 1Y4
11 2A1
DESCRIPTION/ORDERING INFORMATION
This octal buffer/line driver is designed for 1.65-V to 3.6-V V_CC operation.
The SN74ALVC244 is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is
low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
To ensure the high-impedance state during power up or power down, OE shall be tied to V_CC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
T_A
-40°C to 85°C
PACKAGE ⁽¹⁾
TSSOP - PW
Tape and reel
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SN74ALVC244IPWREP
VA244IEP
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004, Texas Instruments Incorporated