SN74ALVC16409 Datasheet, PDF (1/11 Pages) Texas Instruments – 9-BIT, 4-PORT UNIVERSAL BUS EXCHANGER WITH 3-STATE OUTPUTS

SN74ALVC16409
9ĆBIT, 4ĆPORT UNIVERSAL BUS EXCHANGER
WITH 3ĆSTATE OUTPUTS
SCAS259A − NOVEMBER 1993 − REVISED JULY 1995
D EPIC  (Enhanced-Performance Implanted
CMOS) Submicron Process
D Member of the Texas Instruments
Widebus+  Family
D UBE  (Universal Bus Exchanger) Allows
Synchronous Data Exchange
D Designed to Facilitate Incident-Wave
Switching for Line Impedances of 50 Ω
or Greater
D Typical V_OLP (Output Ground Bounce)
< 0.8 V at V_CC = 3.3 V, T_A = 25°C
D Typical V_OHV (Output V_OH Undershoot)
> 2 V at V_CC = 3.3 V, T_A = 25°C
D ESD Protection Exceeds 2000 V Per
MIL-STD-883C, Method 3015; Exceeds
200 V Using Machine Model
(C = 200 pF, R = 0)
D Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
D Latch-Up Performance Exceeds 250 mA
Per JEDEC Standard JESD-17
D Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages
description
The SN74ALVC16409 allows synchronous data
exchange between four different buses.
DGG OR DL PACKAGE
(TOP VIEW)
PRE 1
SEL0 2
1A1 3
GND 4
1A2 5
1A3 6
V_CC 7
1A4 8
1A5 9
1A6 10
GND 11
1A7 12
1A8 13
1A9 14
2A1 15
2A2 16
2A3 17
GND 18
2A4 19
2A5 20
2A6 21
V_CC 22
2A7 23
2A8 24
GND 25
2A9 26
SEL1 27
SEL2 28
56 CLK
55 SELEN
54 1B1
53 GND
52 1B2
51 1B3
50 V_CC
49 1B4
48 1B5
47 1B6
46 GND
45 1B7
44 1B8
43 1B9
42 2B1
41 2B2
40 2B3
39 GND
38 2B4
37 2B5
36 2B6
35 V_CC
34 2B7
33 2B8
32 GND
31 2B9
30 SEL4
29 SEL3
Data flow is controlled by the select (SEL0−SEL4) inputs. A data-flow state is stored on the rising edge of the
clock (CLK) input if the select-enable (SELEN) input is low. Once a data-flow state has been established, data
is stored in the flip-flop on the rising edge of CLK if SELEN is high.
The data-flow control logic is designed to allow glitch-free data transmission.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN74ALVC16409 is available in TI’s shrink small-outline (DL) and thin shrink small-outline (DGG)
packages, which provide twice the I/O pin count and functionality of standard small-outline packages in the
same printed-circuit-board area.
The SN74ALVC16409 is characterized for operation from − 40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus+, EPIC, and UBE are trademarks of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright  1995, Texas Instruments Incorporated
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
• POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
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