SN74AHCT541-EP Datasheet, PDF (1/13 Pages) Texas Instruments – OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS

D Controlled Baseline
− One Assembly/Test Site, One Fabrication
Site
D Enhanced Diminishing Manufacturing
Sources (DMS) Support
D Enhanced Product-Change Notification
D Qualification Pedigree^†
D Inputs Are TTL-Voltage Compatible
D Latch-Up Performance Exceeds 250 mA Per
JESD 17
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
† _{Component qualification in accordance with JEDEC and industry}
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
SN74AHCT541ĆEP
OCTAL BUFFER/DRIVER
WITH 3ĆSTATE OUTPUTS
SCAS778 − SEPTEMBER 2004
DW PACKAGE
(TOP VIEW)
OE1 1
A1 2
A2 ³
A3 ⁴
A4 ⁵
A5 ⁶
A6 ⁷
A7 ⁸
A8 ⁹
GND ¹⁰
20 V_CC
19 OE2
18 Y1
17 Y2
16 Y3
15 Y4
14 Y5
13 Y6
12 Y7
11 Y8
description/ordering information
The SN74AHCT541 octal buffer/driver is ideal for driving bus lines or buffer memory address registers. This
device features inputs and outputs on opposite sides of the package to facilitate printed circuit board layout.
The 3-state control gate is a 2-input AND gate with active-low inputs so that if either output-enable (OE1 or OE2)
input is high, all corresponding outputs are in the high-impedance state. The outputs provide noninverted data
when they are not in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to V_CC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
−40°C to 85°C
SOIC − DW
Tape and reel SN74AHCT541IDWREP AHCT541EP
‡ _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are}
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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Copyright  2004, Texas Instruments Incorporated
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