SN74AC244-EP Datasheet, PDF (1/12 Pages) Texas Instruments – OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS

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FEATURES
• Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
• Extended Temperature Performance of –55°C
to 125°C
• Enhanced Diminishing Manufacturing
Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree ⁽¹⁾
• 2-V to 6-V V_CC Operation
• Inputs Accept Voltages to 6 V
• Max t_pd of 7.5 ns at 5 V
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
SN74AC244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
SCAS723B – OCTOBER 2003 – REVISED APRIL 2006
DW OR NS PACKAGE
(TOP VIEW)
1OE 1
1A1 2
2Y4 3
1A2 4
2Y3 5
1A3 6
2Y2 7
1A4 8
2Y1 9
GND ¹⁰
20 V_CC
19 2OE
18 1Y1
17 2A4
16 1Y2
15 2A3
14 1Y3
13 2A2
12 1Y4
11 _2A1
DESCRIPTION
This octal buffer and line driver is designed specifically to improve the performance and density of 3-state
memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The SN74AC244-EP device is organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs.
When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the
outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to V_CC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
T_A
–55°C to 125°C
SOIC – DW
SOP – NS
PACKAGE ⁽¹⁾
Tape and reel
Tape and reel
ORDERABLE PART
NUMBER
SN74AC244MDWREP
SN74AC244MNSREP
TOP-SIDE MARKING
SAC244MEP
SAC244MEP
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(EACH BUFFER)
INPUTS
OE
A
L
H
L
L
H
X
OUTPUT
Y
H
L
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2006, Texas Instruments Incorporated