PGA308-DIE Datasheet, PDF (1/5 Pages) Texas Instruments – SINGLE-SUPPLY, AUTO-ZERO SENSOR AMPLIFIER WITH PROGRAMMABLE GAIN AND OFFSET

PGA308-DIE
www.ti.com
SBOS624 – JUNE 2012
SINGLE-SUPPLY, AUTO-ZERO SENSOR AMPLIFIER
WITH PROGRAMMABLE GAIN AND OFFSET
Check for Samples: PGA308-DIE
FEATURES
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• Digital Calibration for Bridge Sensors
• Offset Select: Coarse and Fine
• Gain Select: Coarse and Fine
• Bridge Fault Monitor
• Input Mux for Lead Swap
• Over/Under Scale Limits
• D_OUT/ V_OUT Clamp Function
• Seven Banks OTP Memory
• One-Wire Digital UART Interface
• Operating Voltage: 2.7 V to 5.5 V
APPLICATIONS
• Bridge Sensors
• Remote Transmitters
• Strain, Load, Weigh Scales
• Automotive Sensors
DESCRIPTION
The PGA308 is a programmable analog sensor signal conditioner. The analog signal path amplifies the sensor
signal and provides digital calibration for offset and gain. Calibration is done via the 1W pin, a digital One-Wire,
UART-compatible interface. For three-terminal sensor modules, 1W may be connected to V_OUT and the assembly
programmed through the V_OUT pin. Gain and offset calibration parameters are stored onboard in seven banks of
one-time programmable (OTP) memory. The power-on reset (POR) OTP bank may be programmed a total of
four times.
The all-analog signal path contains a 2×2 input multiplexer (mux) to allow electronic sensor lead swapping, a
coarse offset adjust, an auto-zero programmable gain instrumentation amplifier (PGA), a fine gain adjust, a fine
offset adjust, and a programmable gain output amplifier. Fault monitor circuitry detects and signals sensor
burnout, overload, and system fault conditions. Over/under-scale limits provide additional means for system level
diagnostics. The dual-use D_OUT/V_CLAMP pin can be used as a programmable digital output or as a V_OUT over-
voltage clamp.
PRODUCT
PGA308
PACKAGE
DESIGNATOR
TD
ORDERING INFORMATION⁽¹⁾
PACKAGE
ORDERABLE PART NUMBER PACKAGE QUANTITY
Bare die in waffle pack⁽²⁾
PGA308TDD1
100
PGA308TDD2
10
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated