MAX3238-Q1_15 Datasheet, PDF (1/18 Pages) Texas Instruments – LINE DRIVER/RECEIVER WITH ESD PROTECTION

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MAX3238ĆQ1
3ĆV TO 5.5ĆV MULTICHANNEL RSĆ232 LINE DRIVER/RECEIVER
WITH ±15ĆkV ESD (HBM) PROTECTION
SLLS569B − MAY 2003 − REVISED APRIL 2008
D Qualified for Automotive Applications
D ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
D Meets or Exceeds Requirements of
TIA/EIA-232-F and ITU v.28 Standards
D Operates With 3-V to 5.5-V V_CC Supply
D Operates Up To 250 kbit/s
D Five Drivers and Three Receivers
D Low Standby Current . . . 1 µA Typical
D External Capacitors . . . 4 × 0.1 µF
D Accepts 5-V Logic Input With 3.3-V Supply
D Always-Active Noninverting Receiver
Output (ROUT1B)
D RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
DB OR PW PACKAGE
(TOP VIEW)
C2 + 1
GND 2
C2− 3
V− 4
DOUT1 5
DOUT2 6
DOUT3 ⁷
RIN1 ⁸
RIN2 ⁹
DOUT4 ¹⁰
RIN3 ¹¹
DOUT5 ¹²
FORCEON ¹³
FORCEOFF ¹⁴
28 C1+
27 V+
26 V_CC
25 C1−
24 DIN1
23 DIN2
22 DIN3
21 ROUT1
20 ROUT2
19 DIN4
18 ROUT3
17 DIN5
16 ROUT1B
15 INVALID
description/ordering information
The MAX3238 consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV ESD
(HBM) protection pin to pin (serial-port connection pins, including GND). The device meets the requirements
of TIA/EIA-232-F and provides the electrical interface between notebook and subnotebook computer
applications. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. In addition, the device includes an always-active noninverting output (ROUT1B), which allows
applications using the ring indicator to transmit data while the device is powered down. These devices operate
at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.
ORDERING INFORMATION^{
TA
PACKAGE‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
−40°C to 85°C
SSOP (DB) Tape and reel
TSSOP (PW) Tape and reel
MAX3238IDBRQ1
MAX3238IPWRQ1
MAX3238Q
MB3238Q
† _{For the most current package and ordering information, see the Package Option Addendum at}
the end of this document, or see the TI web site at http://www.ti.com.
‡ _{Package drawings, thermal data, and symbolization are available at}
http://www.ti.com/packaging.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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Copyright  2008, Texas Instruments Incorporated
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