MAX208_14 Datasheet, PDF (1/16 Pages) Texas Instruments – MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ESD PROTECTION

MAX208
www.ti.com ................................................................................................................................................ SLLS596C – OCTOBER 2003 – REVISED AUGUST 2009
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
FEATURES
1
• ESD Protection for RS-232 I/O Pins
– ±15-kV Human-Body Model (HBM)
• Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
• Operates at 5-V V_CC Supply
• Four Drivers and Four Receivers
• Operates up to 120 kbit/s
• External Capacitors: 4 × 0.1 µF
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
APPLICATIONS
• Battery-Powered Systems
• PDAs
• Notebooks
• Laptops
• Palmtop PCs
• Hand-Held Equipment
DB OR DW PACKAGE
(TOP VIEW)
DOUT2 ¹
DOUT1 ²
RIN2 ³
ROUT2 ⁴
DIN1 ⁵
ROUT1 ⁶
RIN1 ⁷
GND ⁸
V_CC ⁹
C1+ ¹⁰
V+ ¹¹
C1– ¹²
24 _DOUT3
23 _RIN3
22 _ROUT3
21 _DIN4
20 _DOUT4
19 _DIN3
18 _DIN2
17 _ROUT4
16 _RIN4
15 _V–
14 _C2–
13 _C2+
DESCRIPTION
The MAX208 device consists of four line drivers, four line receivers, and a dual charge-pump circuit with ±15-kV
HBM ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements
of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and
the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V
supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/µs driver output
slew rate.
T_A
0°C to 70°C
–40°C to 85°C
SOIC – DW
SSOP – DB
SOIC – DW
SSOP – DB
ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
Tube of 25
MAX208CDW
Reel of 2000
MAX208CDWR
Tube of 60
MAX208CDB
Reel of 2000
MAX208CDBR
Tube of 25
MAX208IDW
Reel of 2000
MAX208IDWR
Tube of 60
MAX208IDB
Reel of 2000
MAX208IDBR
TOP-SIDE MARKING
MAX208C
MA208C
MAX208I
MB208I
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2009, Texas Instruments Incorporated