LMZ31710 Datasheet, PDF (1/33 Pages) Texas Instruments – 10A SIMPLE SWITCHER® Power Module with 2.95V-17V Input and Current Sharing in QFN Package

LMZ31710
www.ti.com
SNVS987A – JULY 2013 – REVISED JULY 2013
10A SIMPLE SWITCHER® Power Module with 2.95V-17V Input and Current Sharing
in QFN Package
Check for Samples: LMZ31710
FEATURES
1
•2 Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design
• 10mm x 10mm x 4.3mm Package
- Pin Compatible with LMZ31707 & LMZ31704
• Efficiencies Up to 95%
• Eco-Mode / Light Load Efficiency (LLE)
• Wide-Output Voltage Adjust
0.6 V to 5.5 V, with 1% Reference Accuracy
• Supports Parallel Operation for Higher Current
• Optional Split Power Rail allows
Input Voltage Down to 2.95 V
• Adjustable Switching Frequency
(200 kHz to 1.2 MHz)
• Synchronizes to an External Clock
• Provides 180° Out-of-Phase Clock Signal
• Adjustable Slow-Start
• Output Voltage Sequencing / Tracking
• Power Good Output
• Programmable Undervoltage Lockout (UVLO)
• Over-Current & Over-Temperature Protection
• Pre-bias Output Start-up
• Operating Temperature Range: –40°C to 85°C
• Enhanced Thermal Performance: 13.3°C/W
• Meets EN55022 Class B Emissions
- Integrated Shielded Inductor
APPLICATIONS
• Broadband & Communications Infrastructure
• Automated Test and Medical Equipment
• Compact PCI / PCI Express / PXI Express
• DSP and FPGA Point-of-Load Applications
DESCRIPTION
The LMZ31710 SIMPLE SWITCHER power module
is an easy-to-use integrated power solution that
combines a 10-A DC/DC converter with power
MOSFETs, a shielded inductor, and passives into a
low profile, QFN package. This total power solution
allows as few as three external components and
eliminates the loop compensation and magnetics part
selection process.
The 10x10x4.3 mm QFN package is easy to solder
onto a printed circuit board and allows a compact
point-of-load design. Achieves greater than 95%
efficiency and excellent power dissipation capability
with a thermal impedance of 13.3°C/W. The
LMZ31710 offers the flexibility and the feature-set of
a discrete point-of-load design and is ideal for
powering a wide range of ICs and systems.
Advanced packaging technology affords a robust and
reliable power solution compatible with standard QFN
mounting and testing techniques.
Figure 1. SIMPLIFIED APPLICATION
V_IN
PVIN ISHARE
VIN
VOUT
C_IN
SENSE+
LMZ31710
V_OUT
C_OUT
SYNC_OUT
PWRGD
INH/UVLO
VADJ
SS/TR
RT/CLK
STSEL
AGND PGND
R_RT
R_SET
100
95
90
85
80
75
Vout = 2.5 V
70
Fsw = 750 kHz
65
PVIN = 3.3 V, VIN = 5 V
60
PVIN = VIN = 5 V
55
PVIN = VIN = 12 V
50
0 1 2 3 4 5 6 7 8 9 10
Output Current (A)
C001
1
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated