LMZ31530 Datasheet, PDF (1/30 Pages) Texas Instruments – 30A SIMPLE SWITCHER® Power Module with 3.0V-14.5V Input in QFN Package

LMZ31530
www.ti.com
SLVSBC7B – OCTOBER 2013 – REVISED DECEMBER 2013
30A SIMPLE SWITCHER® Power Module with 3.0V-14.5V Input in QFN Package
Check for Samples: LMZ31530
FEATURES
1
•2 Complete Integrated Power Solution;
Smaller than a Discrete Design
• 15 mm × 16 mm × 5.8 mm Package Size
- Pin Compatible with LMZ31520
• Ultra-Fast Load Step Response
• Efficiencies Up To 96%
• Wide-Output Voltage Adjust
0.6 V to 3.6 V, with 1% Reference Accuracy
• Optional Split Power Rails Allows
Input Voltage Down to 3.0V
• Selectable Switching Frequency;
(300 kHz to 850 kHz)
• Selectable Slow-Start
• Adjustable Over Current Limit
• Power Good Output
• Output Voltage Sequencing
• Over Temperature Protection
• Pre-bias Output Start-up
• Operating Temperature Range: –40°C to 85°C
• Enhanced Thermal Performance: 8.6°C/W
• Meets EN55022 Class A Emissions
- Integrated Shielded Inductor
APPLICATIONS
• Broadband and Communications
Infrastructure
• DSP and FPGA Point of Load Applications
• High Density Power Systems
100
95
90
85
80
75
70
65
60
55
50
0
Vout = 1.8 V
Fsw = 500 kHz
PVIN = 3.3 V, VIN = 5 V
PVIN = VIN = 5 V
PVIN = VIN = 12 V
5
10
15
20
25
30
Output Current (A)
C001
DESCRIPTION
The LMZ31530 SIMPLE SWITCHER® power module
is an easy-to-use integrated power solution that
combines a 30-A DC/DC converter with power
MOSFETs, a shielded inductor, and passives into a
low profile, QFN package. This total power solution
allows as few as three external components and
eliminates the loop compensation and magnetics part
selection process.
The 15x16x5.8 mm, QFN package is easy to solder
onto a printed circuit board and allows a compact
point-of-load design. Achieves greater than 95%
efficiency, has ultra-fast load step response and
excellent power dissipation capability with a thermal
impedance of 8.6°C/W. The LMZ31530 offers the
flexibility and the feature-set of a discrete point-of-
load design and is ideal for powering a wide range of
ICs and systems. Advanced packaging technology
affords a robust and reliable power solution
compatible with standard QFN mounting and testing
techniques.
SIMPLIFIED APPLICATION
PVIN
VIN
V5V
VIN
LMZ31530
C_I
SENSE+
INH
VOUT
VOUT
ILIM
FREQ_SEL ^VADJ
PWRGD
SS_SEL
AGND
C_O
R_SET
PGND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
is a trademark of ~ Texas Instruments.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated