LMV841_16 Datasheet, PDF (1/38 Pages) Texas Instruments – LMV84x CMOS Input, RRIO, Low Power, Wide Supply Range, 4.5-MHz Operational Amplifiers

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LMV841, LMV842, LMV844
LMV841-Q1, LMV842-Q1, LMV844-Q1
SNOSAT1H – OCTOBER 2006 – REVISED JULY 2016
LMV84x CMOS Input, RRIO, Low Power, Wide Supply Range, 4.5-MHz Operational
Amplifiers
1 Features
•1 AEC-Q100 Automotive Qualification Test
Guidance With the Following:
– Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature
– Device HBM ESD Classification Level 2
– Device CDM ESD Classification Level C3
• Unless Otherwise Noted, Typical Values at
T_A = 25 °C, V⁺ = 5 V.
• Small 5-Pin SC70 Package (2.00 mm × 1.25 mm
× 0.95 mm)
• Wide Supply Voltage Range: 2.7 V to 12 V
• Specified Performance at 3.3 V, 5 V and ±5 V
• Low Supply Current: 1 mA Per Channel
• Unity Gain Bandwidth: 4.5 MHz
• Open-Loop Gain: 133 dB
• Input Offset Voltage: 500 µV Maximum
• Input Bias Current: 0.3 pA
• CMRR at 112 dB and PSSR at 108 dB
• Input Voltage Noise: 20 nV/√Hz
• Temperature Range: −40°C to 125°C
• Rail-to-Rail Input and Output (RRIO)
2 Applications
• High Impedance Sensor Interface
• Battery-Powered Instrumentation
• High Gain and Instrumentation Amplifiers
• DAC Buffers and Active Filters
3 Description
The LMV84x devices are low-voltage and low-power
operational amplifiers that operate with supply
voltages ranging from 2.7 V to 12 V and have rail-to-
rail input and output capability. Their low offset
voltage, low supply current, and CMOS inputs make
them ideal for high impedance sensor interface and
battery-powered applications.
The single LMV841 is offered in the space-saving 5-
Pin SC70 package, the dual LMV842 in the 8-Pin
VSSOP and 8-Pin SOIC packages, and the quad
LMV844 in the 14-Pin TSSOP and 14-Pin SOIC
packages. These small packages are ideal solutions
for area-constrained PCBs and portable electronics.
The LMV841-Q1, LMV842-Q1, and LMV844-Q1
incorporate enhanced manufacturing and support
processes for the automotive market, including defect
detection methodologies.
Reliability qualification is compliant with the
requirements and temperature grades defined in the
AEC-Q100 standard.
Device Information⁽¹⁾
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LMV841
SC70 (5)
2.00 mm × 1.25 mm
LMV842
VSSOP (8)
SOIC (8)
3.00 mm × 3.00 mm
4.90 mm × 3.91 mm
LMV844
SOIC (14)
TSSOP (14)
8.65 mm × 3.91 mm
5.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Applications
VIN
-
-
+
+
Active Band-Pass Filter
SENSOR
RS
+
VS
+
-
-
-
RS
+
LOAD
High Impedance Sensor Interface
CMOS Input Feature
High-Side, Current-Sensing
Rail-to-Rail Input and Output Feature
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.