LMV821-Q1 Datasheet, PDF (1/24 Pages) Texas Instruments – LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

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LMV821-Q1 is Obsolete
LMV821-Q1
LMV822-Q1
LMV824-Q1
SLOS461F – MARCH 2005 – REVISED JULY 2010
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
Check for Samples: LMV821-Q1, LMV822-Q1, LMV824-Q1
FEATURES
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• Qualified for Automotive Applications
The LMV82x devices are characterized for operation
from –40°C to 125°C.
• 2.5-V, 2.7-V, and 5-V Performance
• –40°C to 125°C Operation
LMV821...DBV PACKAGE
(TOP VIEW)
• No Crossover Distortion
• Low Supply Current at V_CC+ = 5 V
– LMV821: 0.3 mA Typ
– LMV822: 0.5 mA Typ
IN+ 1
GND/V 2
CC-
IN- 3
5V
CC+
4 OUT
– LMV824: 1 mA Typ
• Rail-to-Rail Output Swing
• Gain Bandwidth of 5.5 MHz Typ at 5 V
LMV822...DGK PACKAGE
(TOP VIEW)
• Slew Rate of 1.9 V/µs Typ at 5 V
DESCRIPTION/ORDERING INFORMATION
The LMV821 single, LMV822 dual, and LMV824 quad
devices are low-voltage (2.5 V to 5.5 V), low-power
commodity operational amplifiers. Electrical
characteristics are very similar to the LMV3xx
operational amplifiers (low supply current, rail-to-rail
outputs, input common-mode range that includes
ground). However, the LMV82x devices offer a higher
bandwidth (5.5 MHz typical) and faster slew rate
(1.9 V/µs typical).
1OUT 1
1IN- 2
1IN+ 3
GND/V
CC-
4
8
V
CC+
7 2OUT
6 2IN -
5 2IN +
LMV824...D OR PW PACKAGE
(TOP VIEW)
1OUT 1
1IN- 2
1IN+ 3
14 4OUT
13 4IN–
12 4IN+
The LMV82x devices are cost-effective solutions for
V4
CC+
applications requiring low-voltage/low-power
2IN+ 5
operation and space-saving considerations. The
2IN- 6
LMV821 saves space on printed circuit boards and
2OUT 7
enables the design of small portable electronic
devices (cordless and cellular phones, laptops, PDAs,
PCMIA). It also allows the designer to place the
device closer to the signal source to reduce noise
pickup and increase signal integrity.
ORDERING INFORMATION⁽¹⁾
11
GND/V
CC-
10 3IN+
9 3IN–
8 3OUT
T_A
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER TOP-SIDE MARKING⁽³⁾
Single SOT-23 – DBV
Reel of 3000
LMV821QDBVRQ1
RB1_
Dual
–40°C to 125°C
Quad
MSOP/VSSOP – DGK
SOIC – D
TSSOP – PW
Reel of 2500
Reel of 2500
Reel of 2000
LMV822QDGKRQ1
LMV824QDRQ1
LMV824QPWRQ1
R8B
LMV824Q
MV824Q
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2010, Texas Instruments Incorporated