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LMV712_13 Datasheet, PDF (1/11 Pages) Texas Instruments – LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER
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LMV712
LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER
WITH INDEPENDENT SHUTDOWN
SLOS485 – JANUARY 2006
FEATURES
• 5-MHz Gain Bandwidth Product
• 5-V/μs Slew Rate
• Low Noise: 20 nV/√Hz
• 1.22-mA/Channel Supply Current
• VOS < 3 mV Max
• Low Supply Voltage: 2.7 V to 5 V
• Rail-to-Rail Inputs and Outputs
• Unity Gain Stable
• 1.5-μA Shutdown ICC
• 2.2-μs Turn On
APPLICATIONS
• Power-Amplifier Control Loops
• Cellular Phones
• Portable Equipment
• Wireless LANs
• Radio Systems
• Cordless Phones
DGS PACKAGE
(TOP VIEW)
DRC PACKAGE
(TOP VIEW)
1OUT
1
1IN–
2
1IN+
3
VCC–
4
1SD
5
10
VCC+
9
2OUT
8
2IN−
7
2IN+
6
2SD
1OUT 1
1IN– 2
1IN+ 3
VCC– 4
1SD 5
10 VCC+
9 2OUT
8 2IN−
7 2IN+
6 2SD
DESCRIPTION/ORDERING INFORMATION
The LMV712 dual operational amplifier is a high-performance BiCMOS operational amplifier intended for
applications requiring rail-to-rail inputs, combined with speed and low noise. The device offers a bandwidth of
5 MHz, a slew rate of 5 V/μs, and operates with capacitive loads of up to 200 pF without oscillation.
The LMV712 offers two independent shutdown (1SD, 2SD) pins. This feature allows disabling of each device
separately and reduces the supply current to less than 1 μA typical. The output voltage rapidly and smoothly
ramps up with no glitch as the amplifier comes out of the shutdown mode.
The LMV712 is offered in the space-saving SON (DRC) package and in an MSOP (DGS) package. These
packages are designed to meet the demands of small size, low power, and low cost required by cellular phones
and similar battery-operated portable electronics.
TA
–40°C to 85°C
MSOP – DGS
SON – DRC
ORDERING INFORMATION
PACKAGE (1)
ORDERABLE PART NUMBER
Reel of 2500
LMV712IDGSR
Reel of 250
LMV712IDGST
Reel of 3000
LMV712IDRCR
Reel of 250
LMV712IDRCT
TOP-SIDE MARKING
RNB
PREVIEW
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated