LMV611_16 Datasheet, PDF (1/39 Pages) Texas Instruments – LMV61x Single, Dual, and Quad, 1.4-MHz, Low-Power, General-Purpose 1.8-V Operational Amplifiers

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LMV611, LMV612, LMV614
SNOSC69C – APRIL 2012 – REVISED JULY 2016
LMV61x Single, Dual, and Quad, 1.4-MHz, Low-Power,
General-Purpose 1.8-V Operational Amplifiers
1 Features
•1 Supply Values: 1.8 V (Typical)
• Ensured 1.8-V, 2.7-V, and 5-V Specifications
• Output Swing:
– 80 mV From Rail With 600-Ω Load
– 30 mV From Rail With 2-kΩ Load
• V_CM = 200 mV Beyond Rails
• 100-µA Supply Current (Per Channel)
• 1.4-MHz Gain Bandwidth Product
• Maximum V_OS = 4 mV
• Temperature Range: −40°C to 125°C
2 Applications
• Consumer Communication
• Consumer Computing
• PDAs
• Audio Pre-Amplifiers
• Portable or Battery-Powered Electronic Equipment
• Supply Current Monitoring
• Battery Monitoring
R_SENSE
0.2
Load
I_CHARGE
Typical Application
+
V
R₁
2 kŸ
±
R₂
+
2 kŸ
R₃
+
±
Q1
2N3906
V_OUT
10 kŸ
3 Description
The LMV61x devices are single, dual, and quad low-
voltage, low-power operational amplifiers (op amps).
They are designed specifically for low-voltage,
general-purpose applications. Other important
product characteristics are, rail-to-rail input or output,
low supply voltage of 1.8 V and wide temperature
range. The LMV61x input common mode extends
200 mV beyond the supplies and the output can
swing rail-to-rail unloaded and within 30 mV with 2-kΩ
load at 1.8-V supply. The LMV61x achieves a gain
bandwidth of 1.4 MHz while drawing 100-µA (typical)
quiescent current.
The industrial-plus temperature range of −40°C to
125°C allows the LMV61x to accommodate a broad
range of extended environment applications.
The LMV611 is offered in the tiny 5-pin SC70
package, the LMV612 in space-saving 8-pin VSSOP
and SOIC packages, and the LMV614 in 14-pin
TSSOP and SOIC packages. These small package
amplifiers offer an ideal solution for applications
requiring minimum PCB footprint. Applications with
area constrained PCB requirements include portable
and battery-operated electronics.
Device Information⁽¹⁾
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LMV611
SOT-23 (5)
SC70 (5)
2.92 mm × 1.60 mm
2.00 mm × 1.25 mm
LMV612
VSSOP (8)
SOIC (8)
3.00 mm × 3.00 mm
4.90 mm × 3.91 mm
LMV614
TSSOP (14)
SOIC (14)
5.00 mm × 4.40 mm
8.64 mm × 3.90 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
VOUT
RSENSE x R3 _{xICh arg e 1 : x ICh arg e}
R1
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.