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LMV1031_15 Datasheet, PDF (1/15 Pages) Texas Instruments – LMV1031-20 Amplifier for Internal 3-Wire Analog Microphones and External Preamplifier
LMV1031
www.ti.com
SNOSAP8B – SEPTEMBER 2005 – REVISED MAY 2013
LMV1031-20 Amplifier for Internal 3-Wire Analog Microphones and External Preamplifier
Check for Samples: LMV1031
FEATURES
1
•2 (Typical LMV1031-20, 2V Supply; Unless
Otherwise Noted)
• Signal to Noise Ratio 62 dB
• Output Voltage Noise (A-Weighted) −86 dBV
• Low Supply Current 72 μA
• Supply Voltage 2V to 5V
• Input Impedance >100 MΩ
• Max Input Signal 108 mVPP
• Output Voltage 1.09V
• Temperature Range −40°C to 85°C
• Large Dome 4-Bump DSBGA Package with
Improved Adhesion Technology
APPLICATIONS
• Mobile Communications - Bluetooth
• Accessory Microphone Products
• Cellular Phones
• PDAs
Block Diagram
VDD
VIN
1x
GAIN
VOUT
VDC
DESCRIPTION
The LMV1031 audio amplifier is an ideal replacement
for the JFET preamplifier that is currently used in the
electret microphones. The LMV1031 is optimized for
applications that require extended battery life, such
as Bluetooth communication links. The supply current
for the LMV1031 is only 72 μA. This is a dramatic
reduction from that required for a JFET equipped
microphone. The LMV1031, with its separate output
and supply pins, offers a higher PSRR and eliminates
the need for additional external components.
The LMV1031 is ensured to operate from 2V to 5V
supply voltage over the full temperature range, has a
fixed voltage gain of 20 dB and enhanced SNR
performance. The LMV1031 is optimized for an
output biasing of 1.09V.
The LMV1031 has less than 200Ω of output
impedance over the full audio bandwidth. The gain
response of the LMV1031 is flat within the audio band
and is stable over the temperature range.
The LMV1031 is available in a large dome 4-bump
ultra thin DSBGA package that can easily fit on the
PCB inside the miniature microphone metal can
(package). This package is designed for microphone
PCBs requiring 1 kg adhesion criteria.
Electret Microphone
DIAPHRAGM
xxxxx x
ELECTRET
CONNECTOR
x
x
x
IC
AIRGAP
BACKPLATE
LMV1031
VCC
x
x
VOUT
GND
GND
1
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2013, Texas Instruments Incorporated