LM3204 Datasheet, PDF (1/25 Pages) National Semiconductor (TI) – Miniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF Power Amplifiers

LM3204
www.ti.com
SNVS351B – JUNE 2005 – REVISED NOVEMBER 2005
LM3204 Miniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF
Power Amplifiers
Check for Samples: LM3204
FEATURES
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•2 2MHz (typ.) PWM Switching Frequency
• Operates from a single Li-Ion cell (2.7V to
5.5V)
• Adjustable Output Voltage (0.8V to 3.6V)
• Fast Turn on time when Enabled (50µs Typ.),
3GPP Compliant
• 300mA Maximum load capability (PWM mode)
• 500mA Maximum load capability (Bypass
mode)
• PWM, Forced and Automatic Bypass Mode
• High Efficiency (96% Typ. at 3.6V_IN, 3.2V_OUT at
120mA)
• 10-pin micro SMD Package
• Current Overload Protection
• Thermal Overload Protection
APPLICATIONS
• Cellular Phones
• Hand-Held Radios
• RF PC Cards
• Battery Powered RF Devices
DESCRIPTION
The LM3204 is a DC-DC converter optimized for powering RF power amplifiers (PAs) from a single Lithium-Ion
cell. It steps down an input voltage of 2.7V to 5.5V to an adjustable output voltage of 0.8V to 3.6V. The output
voltage is set using an analog input ( V_CON) for optimizing efficiency of the RF PA at various power levels.
The LM3204 offers superior features and performance for mobile phones and similar RF PA applications. Fixed-
frequency PWM mode minimizes RF interference. Bypass mode turns on an internal bypass switch to power the
PA directly from the battery. LM3204 has both forced and automatic bypass modes. Shutdown mode turns the
device off and reduces battery consumption to 0.1µA (typ.).
The LM3204 is available in a 10-pin lead free micro SMD package. A high switching frequency (2MHz) allows
use of tiny surface-mount components. Only three small external surface-mount components, an inductor and
two ceramic capacitors are required.
Typical Application
V_IN
2.7V to 5.5V
C1
10 PF
C4
0.1 PF
V_CON
0.267V to 1.20V
PV_IN VDD
BYPOUT
EN
SW
BYP ^LM3204
FB
V_CON
PGND SGND
L1
2.2 PH
V_OUT
0.8V to 3.6V
V_OUT = 3 x V_CON
C2
4.7 PF
Connection Diagrams
10–Bump Thin Micro SMD Package, Large Bump. See NS Package Number TLP10NHA.
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated