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LM3200 Datasheet, PDF (1/24 Pages) National Semiconductor (TI) – Miniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF Power Amplifiers
LM3200
www.ti.com
SNVS319C – NOVEMBER 2004 – REVISED APRIL 2013
LM3200 Miniature, Adjustable, Step-Down DC-DC Converter with Bypass Mode for RF
Power Amplifiers
Check for Samples: LM3200
FEATURES
1
•2 2 MHz (typ.) PWM Switching Frequency
• Operates from a Single Li-Ion Cell (2.7V to
5.5V)
• Variable Output Voltage (0.8V to 3.6V)
• 300 mA Maximum Load Capability (PWM
Mode)
• 500 mA Maximum Load Capability (Bypass
Mode)
• PWM, Forced and Automatic Bypass Mode
• High Efficiency (96% Typ at 3.6VIN, 3.2VOUT at
120 mA) from Internal Synchronous
Rectification
• 10-pin DSBGA Package
• Current Overload Protection
• Thermal Overload Protection
APPLICATIONS
• Cellular Phones
• Hand-Held Radios
• RF PC Cards
• Battery Powered RF Devices
DESCRIPTION
The LM3200 is a DC-DC converter optimized for
powering RF power amplifiers (PAs) from a single
Lithium-Ion cell. It steps down an input voltage of
2.7V to 5.5V to a variable output voltage of 0.8V to
3.6V. The output voltage is set using an analog input
( VCON) for optimizing efficiency of the RF PA at
various power levels.
The LM3200 offers superior features and
performance for mobile phones and similar RF PA
applications. Fixed-frequency PWM mode minimizes
RF interference. Bypass mode turns on an internal
bypass switch to power the PA directly from the
battery. LM3200 has both forced and automatic
bypass modes. Shutdown mode turns the device off
and reduces battery consumption to 0.1 µA (typ.).
The LM3200 is available in a 10-pin lead free DSBGA
package. A high switching frequency (2 MHz) allows
use of tiny surface-mount components. Only three
small external surface-mount components, an
inductor and two ceramic capacitors are required.
TYPICAL APPLICATION
VIN
2.7V to 5.5V
CIN
10 PF
VDD PVIN
BYPOUT
EN
SW
BYP LM3200
FB
VCON
VCON
0.267V to 1.20V
PGND SGND
L
2.2 PH
COUT
4.7 PF
VOUT
0.8V to 3.6V
VOUT = 3 x VCON
1
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2013, Texas Instruments Incorporated