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DS90LV049H_15 Datasheet, PDF (1/19 Pages) Texas Instruments – High Temperature 3V LVDS Dual Line Driver and Receiver Pair
NRND
DS90LV049H
www.ti.com
SNLS200A – SEPTEMBER 2005 – REVISED APRIL 2013
DS90LV049H High Temperature 3V LVDS Dual Line Driver and Receiver Pair
Check for Samples: DS90LV049H
FEATURES
1
•2 High Temperature +125°C Operating Range
• Up to 400 Mbps Switching Rates
• Flow-Through Pinout Simplifies PCB Layout
• 50 ps Typical Driver Channel-to-Channel Skew
• 50 ps Typical Receiver Channel-to-Channel
Skew
• 3.3 V Single Power Supply Design
• TRI-STATE Output Control
• Internal Fail-Safe Biasing of Receiver Inputs
• Low Power Dissipation (70 mW at 3.3 V Static)
• High Impedance on LVDS Outputs on Power
Down
• Conforms to TIA/EIA-644-A LVDS Standard
• Available in Low Profile 16 Pin TSSOP
Package
DESCRIPTION
The DS90LV049H is a dual CMOS flow-through
differential line driver-receiver pair designed for
applications requiring ultra low power dissipation,
exceptional noise immunity, and high data
throughput. The device is designed to support data
rates in excess of 400 Mbps utilizing Low Voltage
Differential Signaling (LVDS) technology.
The DS90LV049H drivers accept LVTTL/LVCMOS
signals and translate them to LVDS signals. The
receivers accept LVDS signals and translate them to
3 V CMOS signals. The LVDS input buffers have
internal failsafe biasing that places the outputs to a
known H (high) state for floating receiver inputs. In
addition, the DS90LV049H supports a TRI-STATE
function for a low idle power state when the device is
not in use.
The EN and EN inputs are ANDed together and
control the TRI-STATE outputs. The enables are
common to all four gates.
CONNECTION DIAGRAM
Dual-In-Line
RIN1- 1
RIN1+ 2
RIN2+ 3
RIN2- 4
DOUT2- 5
DOUT2+ 6
DOUT1+ 7
DOUT1- 8
16 EN
15 ROUT1
14 ROUT2
13 GND
12 VDD
11 DIN2
10 DIN1
9 EN
Order Number DS90LV049HMT
Order Number DS90LV049HMTX (Tape and Reel)
PW0016A Package
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2013, Texas Instruments Incorporated