CC2567-PAN1317 Datasheet, PDF (1/2 Pages) Texas Instruments – ANT + Bluetooth® Single-Chip, Dual-Mode Module

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CC2567-PAN1327
CC2567-PAN1317
SWRS099B – DECEMBER 2010 – REVISED JANUARY 2011
ANT + Bluetooth^® Single-Chip, Dual-Mode Module
FEATURES
1
•2 Fully Qualified Bluetooth v2.1 + Enhanced
Data Rate (EDR)
• ANT+ capable
• Bluetooth and ANT Smart Priority Mechanism
Allows Flexible Coexistence and Simultaneous
Operation
• +10 dBm Typical Tx Power with Transmit
Power Control
• - 93 dBm Typical Receiver Sensitivity
• Support for Bluetooth Power Saving Modes
(Sniff, Hold)
• Low Power Scan Method for Page and Inquiry
Scans at 1/3rd Normal Power
• Fast Algorithm for Both ACL and eSCO
• Host Controlled Interface (HCI) Supports Three
and Four Wire UART Transport with Rates of
up to 4Mbps
• Hardware and Software Pre-integration with
TI’s MSP430 Ultra Low-power Microcontroller
• Dimensions: 9 mm x 9.5 mm x 1.8 mm
(CC2567-PAN1327, Integrated Antenna);
6.5 mm x 9.5 mm x 1.8 mm
(CC2567-PAN1317, Without Antenna)”
• Bluetooth, FCC, CE, IC Certified
• Operating Temperature Range: -20C° to 70°C
APPLICATIONS
• ANT+ and Bluetooth Aggregators
• Sports and fitness devices
• Health and wellness devices
• Ability to add ultra low-power ANT+
technology to existing Bluetooth solutions
• Connect current ANT+ applications to mobile
phones and computers via Bluetooth
DESCRIPTION
The following product brief applies to Panasonic’s
Bluetooth module, series number: PAN1327 and
PAN1317. The Bluetooth chip used is the CC2567
from Texas Instruments.
The CC2567-PAN1327/17 is the first dual-mode, ANT
and Bluetooth solution in the market. This solution is
a highly-integrated class 2 HCI module with increased
output power capabilities offered by Panasonic using
TI's CC2567 ANT+ and Bluetooth 2.1 + Enhanced
Data Rate (EDR) dual-mode transceiver. Based on
TI's 7th generation Bluetooth technology, the solution
provides best-in-class Bluetooth RF performance of
+10 dBm typical Tx power and -93 dBm typical
receiver sensitivity. The CC2567-PAN1327/17
module allows customers to connect to mobile
phones and computers over Bluetooth from ANT+
enabled devices, and allows customers with
Bluetooth solutions to add ultra low-power ANT+
connectivity. This solution is provided as a module to
help customers reduce development time, lower
manufacturing costs, save board space, ease
certification, and minimize RF expertise required. For
evaluation and development, a platform is available
that integrates the CC2567-PAN1327/17 module,
Bluetooth stack, Serial Port Profile, ANT+ solution
and sample source applications running on a TI host
controller – MSP430.
The full specification and purchasing of the
CC2567-PAN1327/17 can be found on Panasonic’s
website (www.panasonic.com/ti). The development kit
for this solution is available for order today through
the ANT + Bluetooth Health and Fitness Aggregator
Kit tool folder (www.ti.com/cc2567_pan1327_antbtkit).
More information on TI’s wireless platform solutions
can be found on TI's Wireless Connectivity Wiki
(www.ti.com/connectivitywiki).
Disclaimer:
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any kind, and it may contain errors, omissions and technical inaccuracies. TI does not endorse or warrant any of
the third party products or services referenced on this product brief. This information is provided subject to TI’s
Terms of Use.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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