CC2560-PAN1315 Datasheet, PDF (1/2 Pages) Texas Instruments – Bluetooth® v2.1 + Enhanced Data Rate (EDR) Module

CC2560-PAN1325
CC2560-PAN1315
www.ti.com
SWRS101A – JANUARY 2011 – REVISED MARCH 2011
Bluetooth^® v2.1 + Enhanced Data Rate (EDR) Module
FEATURES
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•2345 Fully Qualified Bluetooth v2.1 + Enhanced
Data Rate (EDR)
• Data Rate up to 2.1 Mbps
• Best-In-Class Bluetooth RF Performance (Tx
Power, Rx Sensitivity, Blocking)
• +10 dBm Typical Tx Power with Transmit
Power Control
• - 93 dBm Typical Receiver Sensitivity
• Support for Bluetooth Power Saving Modes
(Sniff, Hold)
• Low Power Scan Method for Page and Inquiry
Scans at 1/3rd Normal Power
• Fast Algorithm for Both ACL and eSCO
• Host Controlled Interface (HCI) Supports Three
and Four Wire UART Transport with Rates of
up to 4Mbps
• Hardware and Software Pre-integration with
TI’s MSP430™ Ultra Low-Power
Microcontroller and Stellaris^® ARM
Cortex™-M3
• Dimensions: 9 mm x 9.5 mm x 1.8 mm
(CC2560-PAN1325, Integrated Antenna);
6.5 mm x 9.5 mm x 1.8 mm
(CC2560-PAN1315, Without Antenna)
• Bluetooth, FCC, CE, IC Certified
• Operating Temperature Range: -20°C to 70°C
APPLICATIONS
• Cable Rplacement
• Wireless Sensors
• Medical Devices
• Computer Peripherals
• Industrial Control
• Consumer Devices
DESCRIPTION
The following product brief applies to Panasonic’s
Bluetooth module, series number: PAN1325 and
PAN1315. The Bluetooth chip used is the CC2560
from Texas Instruments.
The CC2560-PAN1325/15 is a highly-integrated class
2 HCI module with increased output power
capabilities offered by Panasonic using TI’s CC2560
Bluetooth 2.1+ EDR Transceiver. Based on TI’s 7th
generation Bluetooth technology, the solution
provides best-in-class Bluetooth RF performance of
+10dBm typical transmit power and -93dBm typical
receiver sensitivity. This solution is provided as a
module to help customers reduce development time,
lower manufacturing costs, save board space, ease
certification, and minimize RF expertise required. For
evaluation and development, various platforms are
available which integrate the CC2560-PAN1325/15
module, Bluetooth stack, Profiles (SPP for MSP430,
SPP + A2DP for Stellaris), and sample source
applications running on a TI host controller (MSP430,
Stellaris).
The full specification and purchasing of the
CC2560-PAN1325/15 can be found on Panasonic’s
website (www.panasonic.com/ti). More information on
TI’s wireless platform solutions can be found on
TI's
Wireless
Connectivity
Wiki
(www.ti.com/connectivitywiki).
Disclaimer:
All content in and linked to this product brief is provided by TI "AS IS" without express or implied warranties of
any kind, and it may contain errors, omissions and technical inaccuracies. TI does not endorse or warrant any of
the third party products or services referenced on this product brief. This information is provided subject to TI’s
Terms of Use.
Be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MSP430 is a trademark of Texas Instruments.
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and Stellaris is a registered trademark of Texas Instruments.
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Cortex is a trademark of ARM.
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Bluetooth is a registered trademark of Bluetooth SIG, Inc.
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PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated