BQ51010BEVM-764 Datasheet, PDF (1/25 Pages) Texas Instruments – bq51010BEVM-764 Evaluation Module

User's Guide
SLUUAE3A – August 2013 – Revised December 2013
bq51010BEVM-764 Evaluation Module (WCSP Package)
The bq51010BEVM-764 (EVM) wireless power receiver evaluation kit from TI is a high-performance, easy-
to-use development kit for the design of wireless power solutions. The EVM helps designers to evaluate
the operation and performance of the bq51010B, 7-V power supply for wireless power transfer. The
bq51010B devices provide AC/DC power conversion and regulation while integrating the digital control
required to comply with the Qi-communication protocol. The kit speeds up the development of end-use
applications.
Contents
1 Considerations with this EVM ............................................................................................. 2
2 Modifications ................................................................................................................. 2
3 Recommended Operation Condition ..................................................................................... 2
4 Equipment and EVM setup ................................................................................................ 3
4.1 Schematic ........................................................................................................... 3
4.2 Connector and Test Point Descriptions ......................................................................... 3
4.3 Jumpers and Switches ............................................................................................ 3
4.4 Test Point Descriptions ............................................................................................ 4
4.5 Pin Description of the IC .......................................................................................... 5
5 Test Procedure .............................................................................................................. 6
5.1 Definition ............................................................................................................ 6
5.2 Recommended Test Equipment ................................................................................. 6
5.3 Equipment Setup ................................................................................................... 7
5.4 Procedure ........................................................................................................... 8
6 Test Results ................................................................................................................ 10
6.1 Load Step .......................................................................................................... 10
6.2 Load Dump ........................................................................................................ 10
6.3 Start-Up ............................................................................................................ 11
6.4 Efficiency .......................................................................................................... 12
6.5 Thermal Performance ............................................................................................ 12
7 Layout and Bill of Material ................................................................................................ 14
7.1 Layout .............................................................................................................. 14
7.2 Bill of Materials (BOM) ........................................................................................... 17
List of Figures
1 HPA764 Schematic ......................................................................................................... 3
2 Test Set Up .................................................................................................................. 7
3 Load Step, 0 mA to 600 mA ............................................................................................. 10
4 Load Dump, 500 mA to 0 mA ........................................................................................... 11
5 Start-Up .................................................................................................................... 12
6 Efficiency for the bq51010B versus I_OUT ............................................................................... 12
7 Thermal Image............................................................................................................. 13
8 bq51010BEVM-764 Layout Example .................................................................................. 14
9 bq51010BEVM-764 Top Assembly ..................................................................................... 15
10 bq51010BEVM-764 Top Layer .......................................................................................... 15
11 bq51010BEVM-764 Bottom Copper Layer ............................................................................ 16
bqTESLA is a trademark of Texas Instruments, Inc..
SLUUAE3A – August 2013 – Revised December 2013
bq51010BEVM-764 Evaluation Module (WCSP Package)
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