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AM4376 Datasheet, PDF (1/266 Pages) Texas Instruments – AM437x Sitara Processors
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AM4376, AM4377, AM4378, AM4379
SPRS851C – JUNE 2014 – REVISED APRIL 2016
AM437x Sitara™ Processors
1 Device Overview
1.1 Features
1
• Highlights
– Sitara™ ARM® Cortex®-A9 32-Bit RISC
Processor With Processing Speed up to
1000 MHz
• NEON™ SIMD Coprocessor and Vector
Floating Point (VFPv3) Coprocessor
• 32KB of Both L1 Instruction and Data Cache
• 256KB of L2 Cache or L3 RAM
– 32-Bit LPDDR2, DDR3, and DDR3L Support
– General-Purpose Memory Support (NAND,
NOR, SRAM) Supporting up to 16-Bit ECC
– SGX530 Graphics Engine
– Display Subsystem
– Programmable Real-Time Unit Subsystem and
Industrial Communication Subsystem (PRU-
ICSS)
– Real-Time Clock (RTC)
– Up to Two USB 2.0 High-Speed Dual-Role
(Host or Device) Ports With Integrated PHY
– 10, 100, and 1000 Ethernet Switch Supporting
up to Two Ports
– Serial Interfaces:
• Two Controller Area Network (CAN) Ports
• Six UARTs, Two McASPs, Five McSPIs,
Three I2C Ports, One QSPI, and One HDQ
or 1-Wire
– Security
• Crypto Hardware Accelerators (AES, SHA,
RNG, DES, and 3DES)
• Secure Boot (Avaliable Only on AM437x
High-Security [AM437xHS] Devices)
– Two 12-Bit Successive Approximation Register
(SAR) ADCs
– Up to Three 32-Bit Enhanced Capture (eCAP)
Modules
– Up to Three Enhanced Quadrature Encoder
Pulse (eQEP) Modules
– Up to Six Enhanced High-Resolution PWM
(eHRPWM) Modules
• MPU Subsystem
– ARM Cortex-A9 32-Bit RISC Microprocessor
With Processing Speed up to 1000 MHz
– 32KB of Both L1 Instruction and Data Cache
– 256KB of L2 Cache (Option to Configure as L3
RAM)
– 256KB of On-Chip Boot ROM
– 64KB of On-Chip RAM
1
– Secure Control Module (SCM) (Avaliable Only
on AM437xHS Devices)
– Emulation and Debug
• JTAG
• Embedded Trace Buffer
– Interrupt Controller
• On-Chip Memory (Shared L3 RAM)
– 256KB of General-Purpose On-Chip Memory
Controller (OCMC) RAM
– Accessible to All Masters
– Supports Retention for Fast Wakeup
– Up to 512KB of Total Internal RAM
(256KB of ARM Memory Configured as L3 RAM
+ 256KB of OCMC RAM)
• External Memory Interfaces (EMIFs)
– DDR Controllers:
• LPDDR2: 266-MHz Clock (LPDDR2-533
Data Rate)
• DDR3 and DDR3L: 400-MHz Clock (DDR-
800 Data Rate)
• 32-Bit Data Bus
• 2GB of Total Addressable Space
• Supports One x32, Two x16, or Four x8
Memory Device Configurations
• General-Purpose Memory Controller (GPMC)
– Flexible 8- and 16-Bit Asynchronous Memory
Interface With up to Seven Chip Selects (NAND,
NOR, Muxed-NOR, and SRAM)
– Uses BCH Code to Support 4-, 8-, or 16-Bit
ECC
– Uses Hamming Code to Support 1-Bit ECC
• Error Locator Module (ELM)
– Used With the GPMC to Locate Addresses of
Data Errors From Syndrome Polynomials
Generated Using a BCH Algorithm
– Supports 4-, 8-, and 16-Bit Per 512-Byte Block
Error Location Based on BCH Algorithms
• Programmable Real-Time Unit Subsystem and
Industrial Communication Subsystem (PRU-ICSS)
– Supports Protocols such as EtherCAT®,
PROFIBUS®, PROFINET®, and EtherNet/IP™,
EnDat 2.2, and More
– Two Programmable Real-Time Units (PRUs)
Subsystems With Two PRU Cores Each
• Each Core is a 32-Bit Load and Store RISC
Processor Capable of Running at 200 MHz
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.