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ADC12L063 Datasheet, PDF (1/31 Pages) National Semiconductor (TI) – 12-Bit, 62 MSPS, 354 mW A/D Converter with Internal Sample-and-Hold
ADC12L063
www.ti.com
SNAS144E – JULY 2001 – REVISED MARCH 2013
ADC12L063 12-Bit, 62 MSPS, 354 mW A/D Converter with Internal Sample-and-Hold
Check for Samples: ADC12L063
FEATURES
1
•2 Single Supply Operation
• Low Power Consumption
• Power Down Mode
• On-Chip Reference Buffer
APPLICATIONS
• Ultrasound and Imaging
• Instrumentation
• Cellular Base Stations/Communications
Receivers
• Sonar/Radar
• xDSL
• Wireless Local Loops
• Data Acquisition Systems
• DSP Front Ends
KEY SPECIFICATIONS
• Resolution: 12 Bits
• Conversion Rate: 62 MSPS (min)
• Bandwidth: 170 MHz
• DNL: ±0.5 LSB(typ)
• INL: ±1.0 LSB(typ)
• SNR: 66 dB(typ)
• SFDR: 78 dB(typ)
• Data Latency: 6 Clock Cycles
• Supply Voltage: +3.3V ± 300 mV
• Power Consumption, 62 MHz: 354 mW(typ)
DESCRIPTION
The ADC12L063 is a monolithic CMOS analog-to-
digital converter capable of converting analog input
signals into 12-bit digital words at 62 Megasamples
per second (MSPS), minimum. This converter uses a
differential, pipelined architecture with digital error
correction and an on-chip sample-and-hold circuit to
minimize die size and power consumption while
providing excellent dynamic performance. Operating
on a single 3.3V power supply, this device consumes
just 354 mW at 62 MSPS, including the reference
current. The Power Down feature reduces power
consumption to just 50 mW.
The differential inputs provide a full scale input swing
equal to ±VREF with the possibility of a single-ended
input. Full use of the differential input is
recommended for optimum performance. For ease of
use, the buffered, high impedance, single-ended
reference input is converted on-chip to a differential
reference for use by the processing circuitry. Output
data format is 12-bit offset binary.
This device is available in the 32-lead LQFP package
and will operate over the industrial temperature range
of −40°C to +85°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2013, Texas Instruments Incorporated