TPS54010_15 Datasheet, PDF (9/29 Pages) Texas Instruments – 2.2 – 4 -V, 14-A OUTPUT SYNCHRONOUS BUCK PWM SWITCHER WITH INTEGRATED FETs (SWIFT™)

TPS54010
www.ti.com
SLVS509B – MAY 2004 – REVISED JUNE 2005
tain as much separation as possible while keeping
the layout compact. Connect the bias capacitor from
the VBIAS pin to analog ground using the isolated
analog ground trace. If a slow-start capacitor or RT
resistor is used, or if the SYNC pin is used to select
350-kHz operating frequency, connect them to this
trace.
For operation at full rated load current, the analog
ground plane must provide an adequate
heat-dissipating area. A 3-inch by 3-inch plane of
1-ounce copper is recommended, though not manda-
tory, depending on ambient temperature and airflow.
Most applications have larger areas of internal ground
plane available, and the PowerPAD must be connec-
ted to the largest area available. Additional areas on
the top or bottom layers also help dissipate heat, and
any area available must be used when 6-A or greater
operation is desired. Connection from the exposed
area of the PowerPAD to the analog ground plane
layer must be made using 0.013-inch diameter vias to
avoid solder wicking through the vias.
Eight vias must be in the PowerPAD area with four
additional vias located under the device package. The
size of the vias under the package, but not in the
exposed thermal pad area, can be increased to
0.018. Additional vias beyond the twelve rec-
ommended that enhance thermal performance must
be included in areas not under the device package.
8 PL Ø 0.0130
4 PL Ø 0.0180
Connect Pin 1 to Analog Ground Plane
in This Area for Optimum Performance
Minimum Recommended Thermal Vias: 8 x 0.013 Diameter Inside
PowerPAD Area 4 x 0.018 Diameter Under Device as Shown.
Additional 0.018 Diameter Vias May Be Used if Top Side Analog Ground
Area Is Extended.
0.06 ^0.0150
0.0339
0.0650
0.0500
0.3820 0.3478 _0.0500
0.0500
0.0650
0.0339
Minimum Recommended Top
Side Analog Ground Area
0.2090
0.0256
0.1700
0.1340
0.0630
0.0400
Minimum Recommended Exposed
Copper Area for PowerPAD. 5mm
Stencils May Require 10 Percent
Larger Area
Figure 11. Recommended Land Pattern for 28-Pin PWP PowerPAD
9