SN74CB3T3245_08 Datasheet, PDF (9/17 Pages) Texas Instruments – 8-BIT FET BUS SWITCH 2.5-V/3.3-V LOW-VOLTAGE WITH 5-V-TOLERANT LEVEL SHIFTER

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PACKAGE OPTION ADDENDUM
24-May-2007
PACKAGING INFORMATION
Orderable Device
74CB3T3245DBQRE4
74CB3T3245DBQRG4
74CB3T3245DGVRE4
74CB3T3245DGVRG4
SN74CB3T3245DBQR
SN74CB3T3245DGVR
SN74CB3T3245DW
SN74CB3T3245DWE4
SN74CB3T3245DWG4
SN74CB3T3245DWR
SN74CB3T3245DWRE4
SN74CB3T3245DWRG4
SN74CB3T3245PW
SN74CB3T3245PWE4
SN74CB3T3245PWG4
SN74CB3T3245PWR
SN74CB3T3245PWRE4
SN74CB3T3245PWRG4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SSOP/
QSOP
SSOP/
QSOP
TVSOP
Package
Drawing
DBQ
DBQ
DGV
TVSOP
DGV
SSOP/
QSOP
TVSOP
DBQ
DGV
SOIC
DW
SOIC
DW
SOIC
DW
SOIC
DW
SOIC
DW
SOIC
DW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
20 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 1