LP3893_15 Datasheet, PDF (9/16 Pages) Texas Instruments – 3A Fast-Response Ultra Low Dropout Linear Regulators

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LP3893
SNVS237B – SEPTEMBER 2003 – REVISED APRIL 2013
Figure 22. θ_JA vs Copper (1 Ounce) Area for DDPAK/TO-263 Package
As shown in the graph below, increasing the copper area beyond 1 square inch produces very little improvement.
The minimum value for θ_JA for the DDPAK/TO-263 package mounted to a PCB is 32°C/W.
Figure 23 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient
temperatures, assuming θ_JA is 35°C/W and the maximum junction temperature is 125°C.
Figure 23. Maximum Power Dissipation vs Ambient Temperature for DDPAK/TO-263 Package
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