LMZ21701_15 Datasheet, PDF (9/37 Pages) Texas Instruments – LMZ21701 1 A SIMPLE SWITCHER® Nano Module with 17 V Maximum Input Voltage

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LMZ21701
SNVS853D – AUGUST 2012 – REVISED NOVEMBER 2014
8.3 Package Construction
In order to achieve a small solution size the LMZ21701 Nano Module comes in an innovative MicroSiP™
package. The construction consists of a synchronous buck converter IC embedded inside an FR-4 laminate
substrate, with a power inductor mounted on top of the substrate material. See Figure 12 and Figure 13 below.
The bottom (landing pads) of the package resemble a typical 8-pin DFN package. See the Mechanical drawings
at the end of the datasheet for details on the recommended landing pattern and solder paste stencil information.
Figure 12. LMZ21701 in the SIL0008E Package
INDUCTOR
FR-4 LAMINATE
SUBSTRATE
BOTTOM
COPPER PATTERN
EMBEDDED BUCK IC
Figure 13. LMZ21701 Package Construction Cross Section
(Illustration Only, Not to Scale)
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