CD74HCU04_08 Datasheet, PDF (9/13 Pages) Texas Instruments – High-Speed CMOS Logic Hex Inverter

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PACKAGE MATERIALS INFORMATION
11-Mar-2008
*All dimensions are nominal
Device
CD74HCU04M96
CD74HCU04PWR
Package Type
SOIC
TSSOP
Package Drawing Pins
D
14
PW
14
SPQ
2500
2000
Length (mm)
346.0
346.0
Width (mm)
346.0
346.0
Height (mm)
33.0
29.0
Pack Materials-Page 2