CD54HC374 Datasheet, PDF (9/15 Pages) Texas Instruments – High-Speed CMOS Logic Octal D-Type Flip-Flop, 3-State Positive-Edge Triggered

www.ti.com
PACKAGE OPTION ADDENDUM
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
5962-8974201RA
CD54HC374F3A
CD54HC574F
CD54HC574F3A
CD54HCT374F3A
CD54HCT574F
CD54HCT574F3A
CD74HC374E
CD74HC374M
CD74HC374M96
CD74HC574E
CD74HC574M
CD74HC574M96
CD74HCT374E
CD74HCT374M
CD74HCT374M96
CD74HCT574E
CD74HCT574M
CD74HCT574M96
CD74HCT574PWR
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
CDIP
CDIP
CDIP
CDIP
CDIP
CDIP
CDIP
PDIP
Package
Drawing
J
J
J
J
J
J
J
N
SOIC
DW
SOIC
DW
PDIP
N
SOIC
DW
SOIC
DW
PDIP
N
SOIC
DW
SOIC
DW
PDIP
N
SOIC
DW
SOIC
DW
TSSOP
PW
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
20
1
None
Call TI
Level-NC-NC-NC
20
1
None
Call TI
Level-NC-NC-NC
20
1
None
Call TI
Level-NC-NC-NC
20
1
None
Call TI
Level-NC-NC-NC
20
1
None
Call TI
Level-NC-NC-NC
20
1
None
Call TI
Level-NC-NC-NC
20
1
None
Call TI
Level-NC-NC-NC
20 20
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
20 25
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
20 2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
20 20
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
20 25
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
20 2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
20 20
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
20 25
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
20 2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
20 20
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
20 25
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
20 2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
20 2000
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional}
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
Addendum-Page 1