CC1021 Datasheet, PDF (87/92 Pages) Texas Instruments – Single Chip Low Power RF Transceiver for Narrowband Systems

CC1021
27.2. Recommended PCB Footprint for Package (QFN 32)
Note: The figure is an illustration only and not to scale. There are nine 14 mil (0.36 mm)
diameter via holes distributed symmetrically in the ground plane under the package. See also
the CC1020EMX reference design.
27.3. Package Thermal Properties
Thermal resistance
Air velocity
0
1
2
[m/s]
Rth,j-a [K/W]
21.4
18.9
17.0
27.4. Soldering Information
Recommended soldering profile for both standard leaded packages and Pb-free packages is
according to IPC/JEDEC J-STD-020C.
SWRS045
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