1325652 Datasheet, PDF (81/138 Pages) Texas Instruments – MSP430 Hardware Tools User Guide

www.ti.com
Position
1
2
3
4
5
6
7
8
9
Ref Des
C1, C2
C3, C4
C6, C7,
C10
C5, C11,
C13, C14,
C15
C8
C9
C16
C17
D1
10
J1, J2, J3,
J4
11
J5 , J6
JP3, JP5,
12
JP6, JP7,
JP8, JP9,
JP10
13
JP1, JP2,
JP4
14
15
JTAG
16
BOOTST
17
Q1
18
Q2
19
Insulating
disk to Q2
20
R3, R7
R1, R2,
R4, R6,
21
R8,
R9,R10,
R11, R12
22
R5
23
U1
24
PCB
25
Adhesive
plastic feet
26
D3,D4
27
MSP430
Table B-17. MSP-TS430RGC64B Bill of Materials
No. per
Board
0
0
Description
12pF, SMD0805
47pF, SMD0805
DigiKey Part No.
DNP
DNP
3
10uF/6.3V, SMD0805
MSP-TS430RGC64B
Comment
5
100nF, SMD0805
311-1245-2-ND
1
2.2nF, SMD0805
1
470nF, SMD0805
478-1403-2-ND
1
4.7uF, SMD0805
1
220nF, SMD0805
1
green LED, SMD0805 P516TR-ND
0
16-pin header, TH
SAM1029-16-ND
(Header)
SAM1213-16-ND
(Receptacle)
2
3-pin header, male, TH
7
3-pin header, male, TH SAM1035-03-ND
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder:
place jumpers on pins 2-3 on JP5,
JP6, JP7, JP8, JP9, JP10 place
jumpers on pins 1-2 on JP3,
3
2-pin header, male, TH SAM1035-02-ND
Place jumper on header
10
Jumper
15-38-1024-ND
See Pos. 12 and Pos. 13
1
14-pin connector, male,
TH
HRP14H-ND
0
10-pin connector, male,
TH
"DNP Keep vias free of solder"
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder
12.5pF
0
Crystal
Q2: 4MHz Buerklin:
78D134
DNP: Q2 Keep vias free of solder
http://www.ettinger.de/Ar
0
Insulating disk to Q2
t_Detail.cfm?ART_ART
NUM=70.08.121
2
330 Ω, SMD0805
541-330ATR-ND
3
0 Ohm, SMD0805
541-000ATR-ND
DNP: R6, R8, R9, R10, R11,R12
1
47k Ω, SMD0805
541-47000ATR-ND
1
Socket:
QFN11T064-006-N-HSP
Manuf.: Yamaichi
1
85 x 76 mm
2 layers
4
about 6mm width, 2mm e.g., 3M Bumpons Part
height
No. SJ-5302
Apply to corners at bottom side
2
MSP430F5310 RGC
DNP: enclosed with kit, supplied by TI
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
Hardware
81