SN74LVC1G32_10 Datasheet, PDF (8/18 Pages) Texas Instruments – SINGLE 2-INPUT POSITIVE-OR GATE

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PACKAGE OPTION ADDENDUM
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
SN74LVC1G32DBVR
SN74LVC1G32DBVRE4
SN74LVC1G32DBVRG4
SN74LVC1G32DBVT
SN74LVC1G32DBVTE4
SN74LVC1G32DBVTG4
SN74LVC1G32DCKR
SN74LVC1G32DCKRE4
SN74LVC1G32DCKRG4
SN74LVC1G32DCKT
SN74LVC1G32DCKTE4
SN74LVC1G32DCKTG4
SN74LVC1G32DRLR
SN74LVC1G32DRLRG4
SN74LVC1G32DRYR
SN74LVC1G32DRYRG4
SN74LVC1G32YZPR
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOT-23
Package
Drawing
DBV
SOT-23
DBV
SOT-23
DBV
SOT-23
DBV
SOT-23
DBV
SOT-23
DBV
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SOT
DRL
SOT
DRL
SON
DRY
SON
DRY
DSBGA
YZP
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
5 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 5000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 5000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 3000 Green (RoHS & SNAGCU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
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