SN74CBT3383C Datasheet, PDF (8/15 Pages) Texas Instruments – 10-BIT FET BUS-EXCHANGE SWITCH 5-VBUS SWITCH WITH-2-V UNDERSHOOT PROTECTION

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PACKAGE OPTION ADDENDUM
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
SN74CBT3383CDBQR
SN74CBT3383CDBQRE4
SN74CBT3383CDBQRG4
SN74CBT3383CDBR
SN74CBT3383CDBRE4
SN74CBT3383CDGVR
SN74CBT3383CDGVRE4
SN74CBT3383CDW
SN74CBT3383CDWE4
SN74CBT3383CDWR
SN74CBT3383CDWRE4
SN74CBT3383CPW
SN74CBT3383CPWE4
SN74CBT3383CPWR
SN74CBT3383CPWRE4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SSOP/
QSOP
SSOP/
QSOP
SSOP/
QSOP
SSOP
Package
Drawing
DBQ
DBQ
DBQ
DB
SSOP
DB
TVSOP
DGV
TVSOP
DGV
SOIC
DW
SOIC
DW
SOIC
DW
SOIC
DW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
24 2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
24 2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
24 2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Addendum-Page 1