SN74CB3Q3245_10 Datasheet, PDF (8/21 Pages) Texas Instruments – 8-BIT FET BUS SWITCH 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH

PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
PACKAGING INFORMATION
Orderable Device
74CB3Q3245DBQRE4
74CB3Q3245DBQRG4
74CB3Q3245DGVRE4
74CB3Q3245DGVRG4
74CB3Q3245RGYRG4
SN74CB3Q3245DBQR
SN74CB3Q3245DGVR
SN74CB3Q3245GQNR
SN74CB3Q3245PW
SN74CB3Q3245PWE4
SN74CB3Q3245PWG4
SN74CB3Q3245PWR
SN74CB3Q3245PWRE4
SN74CB3Q3245PWRG4
SN74CB3Q3245RGYR
SN74CB3Q3245ZQNR
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
Package
Type
SSOP/
QSOP
SSOP/
QSOP
TVSOP
Package
Drawing
DBQ
DBQ
DGV
ACTIVE TVSOP
DGV
ACTIVE
VQFN
RGY
ACTIVE
ACTIVE
SSOP/
QSOP
TVSOP
DBQ
DGV
NRND
ACTIVE
BGA MI
CROSTA
R JUNI
OR
TSSOP
GQN
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE
VQFN
RGY
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQN
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
20 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 1000
TBD
SNPB
Level-1-240C-UNLIM
20 70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 1000 Green (RoHS & SNAGCU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
Addendum-Page 1