CD4001BME4 Datasheet, PDF (8/19 Pages) Texas Instruments – CMOS NOR Gates

PACKAGE OPTION ADDENDUM
www.ti.com
25-Jan-2012
Orderable Device
CD4025BMTE4
CD4025BMTG4
CD4025BNSR
CD4025BNSRE4
CD4025BNSRG4
CD4025BPW
CD4025BPWE4
CD4025BPWG4
JM38510/05252BCA
JM38510/05254BCA
M38510/05252BCA
M38510/05254BCA
Status ^{(1) Package Type Package}
Drawing
ACTIVE
SOIC
D
Pins
14
Package Qty
250
ACTIVE
SOIC
D
14
250
ACTIVE
SO
NS
14
2000
ACTIVE
SO
NS
14
2000
ACTIVE
SO
NS
14
2000
ACTIVE
TSSOP
PW
14
90
ACTIVE
TSSOP
PW
14
90
ACTIVE
TSSOP
PW
14
90
ACTIVE
CDIP
J
14
1
ACTIVE
CDIP
J
14
1
ACTIVE
CDIP
J
14
1
ACTIVE
CDIP
J
14
1
Eco Plan ⁽²⁾
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
TBD
TBD
TBD
Lead/
Ball Finish
MSL Peak Temp ⁽³⁾
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
A42
N / A for Pkg Type
A42
N / A for Pkg Type
A42
N / A for Pkg Type
A42
N / A for Pkg Type
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
(Requires Login)
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 4