TLE207XA_07 Datasheet, PDF (71/83 Pages) Texas Instruments – EXCALIBUR LOW-NOISE HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS

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PACKAGE OPTION ADDENDUM
9-Oct-2007
Orderable Device
TLE2074CDWR
TLE2074CDWRG4
TLE2074CN
TLE2074CNE4
TLE2074IDW
TLE2074IDWG4
TLE2074IDWR
TLE2074IN
TLE2074INE4
TLE2074MFKB
TLE2074MJ
TLE2074MJB
TLE2074MWB
Status ⁽¹⁾
ACTIVE
Package
Type
SOIC
Package
Drawing
DW
ACTIVE
SOIC
DW
ACTIVE
PDIP
N
ACTIVE
PDIP
N
ACTIVE
SOIC
DW
ACTIVE
SOIC
DW
OBSOLETE SOIC
DW
ACTIVE
PDIP
N
ACTIVE
PDIP
N
ACTIVE
LCCC
FK
ACTIVE
CDIP
J
ACTIVE
CDIP
J
ACTIVE
CFP
W
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16
TBD
Call TI
Call TI
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
20
1
TBD
POST-PLATE N / A for Pkg Type
14
1
TBD
A42 SNPB N / A for Pkg Type
14
1
TBD
A42 SNPB N / A for Pkg Type
14
1
TBD
A42 SNPB N / A for Pkg Type
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4