OPA4172 Datasheet, PDF (7/42 Pages) Texas Instruments – OPAx172 36-V, Single-Supply, 10-MHz, Rail-to-Rail Output Operational Amplifiers

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OPA172, OPA2172, OPA4172
SBOS618H – DECEMBER 2013 – REVISED SEPTEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
MIN
Supply voltage, V_S
Signal input pins
Voltage ⁽²⁾
Common-mode
Differential ⁽³⁾
(V–) – 0.5
Output short circuit⁽⁴⁾
Current
Operating
–55
Temperature
Junction
Storage, T_stg
–65
MAX
±20 (+40, single supply)
(V+) + 0.5
±0.5
±10
Continuous
+150
+150
+150
UNIT
V
V
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Transient conditions that exceed these voltage ratings must be current limited to 10 mA or less.
(3) Refer to the Electrical Overstress section for more information.
(4) Short-circuit to ground, one amplifier per package.
7.2 ESD Ratings
V_(ESD)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Electrostatic discharge _{Charged-device model (CDM), per JEDEC specification JESD22-C101(2)}
VALUE
±4000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage (V+ – V–)
Specified temperature
MIN
4.5 (±2.25)
–40
NOM
MAX
36 (±18)
125
UNIT
V
°C
7.4 Thermal Information: OPA172
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
D (SOIC)
8 PINS
126.5
80.6
67.1
31.0
66.6
N/A
OPA172
DBV (SOT-23)
5 PINS
227.9
115.7
65.9
10.7
65.3
N/A
DCK (SC70)
5 PINS
285.2
60.5
78.9
0.8
77.9
N/A
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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