OPA313_15 Datasheet, PDF (7/38 Pages) Texas Instruments – 1-MHz, Micro-Power, Low-Noise, RRIO,1.8-V CMOS OPERATIONAL AMPLIFIER Precision Value Line Series

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OPA313
OPA2313
OPA4313
SBOS649C – SEPTEMBER 2012 – REVISED MARCH 2013
THERMAL INFORMATION: OPA313
THERMAL METRIC⁽¹⁾
θ_JA
θ_JC(top)
θ_JB
ψ_JT
ψ_JB
θ_JC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
OPA313
DBV (SOT23)
DCK (SC70)
5 PINS
5 PINS
228.5
281.4
99.1
91.6
54.6
59.6
7.7
1.5
53.8
58.8
N/A
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA2313
THERMAL METRIC⁽¹⁾
θ_JA
θ_JC(top)
θ_JB
ψ_JT
ψ_JB
θ_JC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
D (SO)
8 PINS
138.4
89.5
78.6
29.9
78.1
N/A
OPA2313
DGK (MSOP)
8 PINS
191.2
61.9
111.9
5.1
110.2
N/A
DRG (DFN)
8 PINS
53.8
69.2
20.1
3.8
20.0
11.6
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA4313
THERMAL METRIC⁽¹⁾
θ_JA
θ_JC(top)
θ_JB
ψ_JT
ψ_JB
θ_JC(bottom)
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
OPA4313
PW (TSSOP)
14 PINS
121.0
49.4
62.8
5.9
62.2
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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