CD54HC125_06 Datasheet, PDF (7/12 Pages) Texas Instruments – High-Speed CMOS Logic Quad Buffer, Three-State

www.ti.com
PACKAGE OPTION ADDENDUM
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
CD54HC125F
CD54HC125F3A
CD54HCT125F3A
CD74HC125E
CD74HC125EE4
CD74HC125M
CD74HC125M96
CD74HC125M96E4
CD74HC125ME4
CD74HC125MT
CD74HC125MTE4
CD74HCT125E
CD74HCT125EE4
CD74HCT125M
CD74HCT125M96
CD74HCT125M96E4
CD74HCT125ME4
CD74HCT125MT
CD74HCT125MTE4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
CDIP
CDIP
CDIP
PDIP
Package
Drawing
J
J
J
N
PDIP
N
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
PDIP
N
PDIP
N
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
14
1
TBD
A42 SNPB N / A for Pkg Type
14
1
TBD
A42 SNPB N / A for Pkg Type
14
1
TBD
A42 SNPB N / A for Pkg Type
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
Addendum-Page 1