TLE206X_08 Datasheet, PDF (63/78 Pages) Texas Instruments – EXCALIBUR JFET-INPUT HIGH-OUTPUT-DRIVE uPOWER OPERATIONAL AMPLIFIERS

www.ti.com
PACKAGE OPTION ADDENDUM
4-Mar-2008
Orderable Device
TLE2064CDR
TLE2064CDRG4
TLE2064CN
TLE2064CNE4
TLE2064CNSR
TLE2064ID
TLE2064IDG4
TLE2064IDR
TLE2064IDRG4
TLE2064IN
TLE2064INE4
TLE2064MD
TLE2064MDG4
TLE2064MDR
TLE2064MDRG4
TLE2064MFKB
TLE2064MJ
TLE2064MJB
TLE2064MN
TLE2064MWB
Status ⁽¹⁾
ACTIVE
Package
Type
SOIC
Package
Drawing
D
ACTIVE
SOIC
D
ACTIVE
PDIP
N
ACTIVE
PDIP
N
OBSOLETE SO
NS
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
PDIP
N
ACTIVE
PDIP
N
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
LCCC
FK
ACTIVE
CDIP
J
ACTIVE
CDIP
J
OBSOLETE PDIP
N
ACTIVE
CFP
W
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
14 2500 Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
14 2500 Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14
TBD
Call TI
Call TI
14
50 Green (RoHS &
Call TI
Level-1-260C-UNLIM
no Sb/Br)
14
50 Green (RoHS &
Call TI
Level-1-260C-UNLIM
no Sb/Br)
14 2500 Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
14 2500 Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14 50
TBD
CU NIPDAU Level-1-220C-UNLIM
14 50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14
1
TBD
CU NIPDAU Level-1-220C-UNLIM
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20
1
TBD
POST-PLATE N / A for Pkg Type
14
1
TBD
A42 SNPB N / A for Pkg Type
14
1
TBD
A42 SNPB N / A for Pkg Type
14
TBD
Call TI
Call TI
14
1
TBD
A42 SNPB N / A for Pkg Type
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 5