ADSP-BF516BSWZ-4 Datasheet, PDF (63/68 Pages) Analog Devices – Blackfin Embedded Processor

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
OUTLINE DIMENSIONS
Dimensions in Figure 72 are shown in millimeters.
0.75
0.60
0.45
1.00 REF
1.60
MAX
176
1
26.20
26.00 SQ
25.80
PIN 1
24.10
24.00 SQ
23.90
NOTE: THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND
THERMALLY CONNECTED TO GND. IMPLEMENT THIS BY
SOLDERING THE EXPOSED PAD TO A GND PCB LAND THAT IS
THE SAME SIZE AS THE EXPOSED PAD. THE GND PCB LAND
SHOULD BE ROBUSTLY CONNECTED TO THE GND PLANE IN
THE PCB WITH AN ARRAY OF THERMAL VIAS FOR BEST
PERFORMANCE.
133
133
176
132
132
1
1.45
1.40
1.35
0.15
0.10
0.05
12°
SEATING
PLANE
0.20
0.15
0.09
7°
0°
0.08 MAX
COPLANARITY
VIEW A
ROTATED 90° CCW
TOP VIEW
(PINS DOWN)
44
45
VIEW A
0.50
BSC
LEAD PITCH
89
88
89
88
0.27
0.22
0.17
COMPLIANT TO JEDEC STANDARDS MS-026-BGA-HD
Figure 72. 176-Lead Low Profile Quad Flat Package [LQFP_EP]
(SQ-176-2)
Dimensions shown in millimeters
EXPOSED
PAD
5.80 REF
SQ
BOTTOM VIEW
(PINS UP)
44
45
EXPOSED PAD IS CENTERED ON
THE PACKAGE.
Rev. B | Page 63 of 68 | January 2011