SMJ320C6701_15 Datasheet, PDF (61/66 Pages) Texas Instruments – FLOATING-POINT DIGITAL SIGNAL PROCESSOR

SMJ320C6701
FLOATINGĆPOINT DIGITAL SIGNAL PROCESSOR
SGUS060A − DECEMBER 2007 − REVISED JULY 2009
PACKAGE CHARACTERISTICS
thermal resistance characteristics (S-CBGA and S-CLGA packages)
NO
1 RΘ_JC Junction-to-Case, measured to the bottom of solder ball
2 RΘ_JC Junction-to-Case, measured to the top of the package lid
3 RΘ_JA Junction-to-Ambient
4
5 RΘ_JMA Junction-to-Moving-Air
6
Junction-to-Board, measured by soldering a thermocouple to one of the middle
7 RΘ_{JB traces on the board at the edge of the package}
°C/W
3.0
7.3
14.5
11.8
11.1
10.2
6.2
Air Flow
N/A
N/A
0
150 fpm
250 fpm
500 fpm
N/A
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